Sputtering target process flow:
Raw powder → powder smelting → powder mixing → press forming → atmosphere sintering → plastic processing → heat treatment → ultrasonic flaw detection → water cutting → mechanical processing → metallization → binding → ultrasonic testing → ultrasonic cleaning → final inspection → packaging and delivery.
Component quality control
Composition analysis of raw materials:
Through the detection and analysis of ICP, GDMS and other equipment, the content of metal impurities is ensured to meet the standard of purity;
The content of nonmetallic impurities is detected by carbon-sulfur analyzer, nitrogen-oxygen analyzer and other equipment.
Metallographic inspection analysis:
The target material is detected by flaw detection equipment to ensure that there are no defects and shrinkage cavities in the product;
Through metallographic test, the degree of grain inside the target is detected to ensure that the grain is fine.
Appearance size detection:
Measure the product size by micrometer and precision caliper to ensure that it meets the requirements of customer drawings;
The surface smoothness and cleanliness of products are measured by surface cleanliness measuring instrument.
Element introduction | Elemental properties | ||
Chinese name | hafnium (Hf) | dilatation coefficient | （25℃）5.9μm·m-1·K-1 |
symbol of element | Hf | thermal conductivity | 23.0W·m-1·K-1 |
CAS number | 7440-58-6 | electrical resistivity | （20℃）331nΩ·m |
state of matter | solid | Young's modulus | 78 GPa |
density | 13.31g·cm3 | shear modulus | 30GPa |
melting point | 2233℃ | bulk modulus | 110 GPa |
boiling point | 4603℃ | Mohs hardness | 5.5 |
melting heat | 27.2 kJ·mol-1 | Brinell hardness | 1450-2100Mpa |
heat of vapourization | - | Magnetic sequence | paramagnetism |
specific heat capacity | 25.73 J·mol-1·K-1 | crystalline structure | Hexagonal close packing |
Applicable equipment and application fields
Applicable equipment: coating materials used in PVD technology, various single target systems, multi-target sputtering systems, ion sputtering systems and other magnetron sputtering equipment.
Application fields: scientific experimental research applications, nano-machining, device manufacturing and other related products, widely used in flat panel display, semiconductor, solar cells, optical components, energy-saving glass and other fields.
