Sputtering target process flow:
Raw powder → powder smelting → powder mixing → press molding → atmosphere sintering → plastic processing → heat treatment → ultrasonic flaw detection → water cutting → mechanical processing → metallization → binding → ultrasonic testing → ultrasonic cleaning → final inspection → packaging and delivery.
Component quality control
Composition analysis of raw materials:
Through the detection and analysis of ICP, GDMS and other equipment, the content of metal impurities is ensured to meet the standard of purity;
The content of nonmetallic impurities is detected by carbon-sulfur analyzer, nitrogen-oxygen analyzer and other equipment.
Metallographic inspection analysis:
The target material is detected by flaw detection equipment to ensure that there are no defects and shrinkage cavities in the product;
Through metallographic test, the degree of grain inside the target is detected to ensure that the grain is fine.
Appearance size detection:
Measure the product size by micrometer and precision caliper to ensure that it meets the requirements of customer drawings;
The surface smoothness and cleanliness of products are measured by surface cleanliness measuring instrument.
| Element introduction | Elemental properties | ||
| Chinese name | lead | dilatation coefficient | （25℃）28.9μm·m-1·K-1 |
| symbol of element | Pb | thermal conductivity | 35.3W·m-1·K-1 |
| CAS number | 7439-92-1 | electrical resistivity | （20℃）208nΩ·m |
| state of matter | solid | Young's modulus | 16GPa |
| density | 11.34·cm3 | shear modulus | 5.6 GPa |
| melting point | 327.46℃ | bulk modulus | 46 GPa |
| boiling point | 1749℃ | Mohs hardness | 1.5 |
| melting heat | 4.77 kJ·mol-1 | Brinell hardness | 38.3Mpa |
| heat of vapourization | 179.5 kJ·mol-1 | Magnetic sequence | Antimagnetism |
| specific heat capacity | 26.65 J·mol-1·K-1 | crystalline structure | Face centered cubic |
Applicable equipment: coating materials used in PVD technology, various single target systems, multi-target sputtering systems, ion sputtering systems and other magnetron sputtering equipment.
Application fields: scientific experimental research applications, nano-machining, device manufacturing and other related products, widely used in flat panel display, semiconductors, solar cells, optical components, energy-saving glass and other fields.
