Sputtering target process flow:
Raw powder → powder smelting → powder mixing → press forming → atmosphere sintering → plastic processing → heat treatment → ultrasonic flaw detection → water cutting → mechanical processing → metallization → binding → ultrasonic testing → ultrasonic cleaning → final inspection → packaging and delivery.
Component quality control
Composition analysis of raw materials:
Through the detection and analysis of ICP, GDMS and other equipment, the content of metal impurities is ensured to meet the standard of purity;
The content of nonmetallic impurities is detected by carbon-sulfur analyzer, nitrogen-oxygen analyzer and other equipment.
Metallographic inspection analysis:
The target material is detected by flaw detection equipment to ensure that there are no defects and shrinkage cavities in the product;
Through metallographic test, the degree of grain inside the target is detected to ensure that the grain is fine.
Appearance size detection:
Measure the product size by micrometer and precision caliper to ensure that it meets the requirements of customer drawings;
The surface smoothness and cleanliness of products are measured by surface cleanliness measuring instrument.
Packaging and storage instructions
Out-of-warehouse packaging: internal vacuum bag vacuum packaging, external labeling (packaging according to demand), carton foam pad express transportation.
Storage method: store in a dry environment, avoid moisture, seal and package, handle with care, and prevent pressure and collision.
Caution: Please wear dust-proof gloves to operate before use, and observe whether the target surface is clean, so as to avoid direct hand contact operation and other foreign objects polluting the target.
Element introduction
Elemental properties
Chinese name
vanadium
dilatation coefficient
（25℃）8.4μm·m-1·K-1
symbol of element
V
thermal conductivity
30.7W·m-1·K-1
CAS number
7440-62-2
electrical resistivity
（20℃）197nΩ·m
state of matter
solid
Young's modulus
128 GPa
density
6.0g·cm3
shear modulus
47 GPa
melting point
1910℃
bulk modulus
160 GPa
boiling point
3407℃
Mohs hardness
6.7
melting heat
21.5 kJ·mol-1
Brinell hardness
750Mpa
heat of vapourization
444 kJ·mol-1
Magnetic sequence
paramagnetism
specific heat capacity
24.89 J·mol-1·K-1
crystalline structure
body-centered cubic
Applicable equipment and application fields
Applicable equipment: coating materials used in PVD technology, various single target systems, multi-target sputtering systems, ion sputtering systems and other magnetron sputtering equipment.
Application fields: scientific experimental research applications, nano-machining, device manufacturing and other related products, widely used in flat panel display, semiconductors, solar cells, optical components, energy-saving glass and other fields.
